“The thermal interface pads & material market comprises various products used for transferring heat from electronic components to heat sinks in a wide range of electronic applications across different industries. Thermal interface pads & materials are widely used in consumer electronics, telecom equipment, power supply units, and others. This report segments the said market based on type, product, application, and geography. The report entails the analyses and forecasts related to the thermal interface pads & material market.
The global thermal interface pads & material market is estimated to reach at $1379.02 million by 2020, at a CAGR of 8.47% from 2015 to 2020. The PCM market is expected to grow at a highest CAGR; its growth is expected to be driven by consumer electronics and telecom equipment industries.
The market has been segmented based on geography into North America, Europe, Africa, APAC, and RoW. APAC is currently the largest market for thermal interface pads & material markets and is expected to exhibit a high growth rate in the next seven years.
Some of the prominent companies in this market include 3M (U.S.), Dow Corning (U.S.), Parker Chomerics (U.S.), and Laird Technologies (U.K.).
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