“The encapsulation technique is a process in which primarily materials such as polymers, ceramics, and metals are applied in the form of a solid or liquid on the devices. One of the major reasons for choosing the encapsulation technique for devices is the growing trend of miniaturization, where smaller and complex structures of devices need to be managed without harming the performance of the device. In the liquid encapsulation process, liquid encapsulant materials are implanted on the device to overcome issues such as misconnection of electrical components on devices and to ensure proper functioning of the device. Liquid encapsulation materials or semiconductor encapsulants majorly consist of epoxy resin and epoxy-modified resin materials.
The major drivers for the growth of this market include the growing demand for advanced packaging techniques, increasing demand for consumer electronics products, and growing trend of miniaturization of electronics products. One of the major opportunities for this market is the new growth avenues offered by automotive electronics application in the market. However, the sluggish demand for liquid encapsulants in developed regions such as North America & Europe is restraining the growth of the global liquid encapsulation materials market.
The global liquid encapsulation materials market is projected to grow at a CAGR of 6.7% between 2015 and 2020, from an estimated value of USD 1,011.97 million in 2015 to reach USD 1,397.46 million by 2020. With regard to the various products considered for the market, integrated circuits are estimated to account for more than 75% of the total market till 2020. Similarly, electronics applications are considered to hold the major market share among all the applications till 2020.
The major players in the global liquid encapsulation materials market are Shin-Etsu Chemical Co., Ltd. (Japan), Sumitomo Bakelite Co., Ltd. (Japan), Hitachi Chemical Co. Ltd. (Japan), Henkel AG and Co. KGaA (Germany), Kyocera Corporation (Japan), Nagase & Co., Ltd. (Japan), Nitto Denko Corporation (Japan), Panasonic Corporation (Japan), BASF Se (Germany), Sanyu Rec Co. Ltd. (Japan), Resin Technical Systems (U.K.), and Epic “
