Chemical mechanical planarization (CMP) is an enabling technology in the wafer fabrication of integrated circuits and has been widely used in the wafer manufacturing process in different electronic devices such as semiconductors, optoelectronics, and optics for reducing chip size & improving performance. Continuous research & development efforts and associated technological breakthroughs in the area of cost-effective production & processing have fueled its market growth in the last decade and growth is expected to continue in the near future. The global CMP market was valued at USD 3.32 billion in 2014 and is expected reach USD 4.94 billion by 2020, at a CAGR of 6.83% from 2015 to 2020. Growing need of CMP for wafer planarization, high demand for consumer electronic products, and increasing use of micro-electro-mechanical systems (MEMS) are expected to drive the growth of the CMP market during the forecast period. The global CMP market is quite competitive, with the presence of prominent CMP equipment manufacturers and consumable suppliers.
The major CMP equipment manufacturer are Applied Materials, Inc. (U.S.), Ebara Corporation (Japan), Strasbaugh Inc. (U.S.), Lam Research Corporation(U.S.), and Lapmaster Wolters GmbH(Germany),while some of the key CMP consumable suppliers are Cabot Microelectronics Corporation (U.S.), Fujimi Incorporated (Japan), Dow Electronic Materials (U.S.), Hitachi Chemical Company, Ltd. (Japan), and Air Products & Chemicals, Inc. (U.S.).
