Thermal Interface Pads & Material Market by Type (Phase Change Material, Thermal Grease, Thermal Pads), Products (MOSFET, Thyristor, IGBT), Application (Consumer Electronics, Telecom Equipment, Power Supply Units) – Forecast to 2020

Date: 2015-07

“The thermal interface pads & material market comprises various products used for transferring heat from electronic components to heat sinks in a wide range of electronic applications across different industries. Thermal interface pads & materials are widely used in consumer electronics, telecom equipment, power supply units, and others. This report segments the said market based on type, product, application, and geography. The report entails the analyses and forecasts related to the thermal interface pads & material market.

. Based on the type of materials used, the thermal interface pads & material market has been classified into phase change material, thermal pads, thermal grease, and others. The said market has been segmented on the basis of application into consumer electronics, telecom equipment, power supply units, and others.

The global thermal interface pads & material market is estimated to reach at $1379.02 million by 2020, at a CAGR of 8.47% from 2015 to 2020. The PCM market is expected to grow at a highest CAGR; its growth is expected to be driven by consumer electronics and telecom equipment industries.

The market has been segmented based on geography into North America, Europe, Africa, APAC, and RoW. APAC is currently the largest market for thermal interface pads & material markets and is expected to exhibit a high growth rate in the next seven years.

The report also details the competitive landscape of the thermal interface pads & materials market by analyzing the strategies adopted by the major players to achieve growth in the market. Apart from the market segmentation data, the report also includes qualitative analysis of various market dynamics such as the drivers, restraints, opportunities, burning issues, and winning imperatives. It also analyzes the overall market through various models; such as the Porter’s Five Forces framework. The report includes the profiles of the major market players in the global thermal interface pads & material market along with their respective market share analyses.
Some of the prominent companies in this market include 3M (U.S.), Dow Corning (U.S.), Parker Chomerics (U.S.), and Laird Technologies (U.K.).

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