Global 3D Sensor Market (2016 – 2022)

Date: 2016-09

“3D sensing, which allows users to measure depth, range, and distance of an object by using laser as well as other light sources for generating three-dimensional features, is a rapidly emerging engineering discipline in the overall sensors industry. 3D sensing represents a dynamic technology with significant applications in a wide range of industry verticals including consumer electronics, automotive, industrial robotics, security and surveillance, healthcare, and others. The transition from 2D to 3D technology is gaining momentum across all types of electronic devices and equipment. Major factors driving the transition are the many inherent advantages offered by 3D sensors such as reduced production/design time, time-to-market efficiencies, superior measurement accuracy, and lower error margins, among others.
The report highlights the adoption of 3D Sensor. Based on the Type, the 3D Sensor market is segmented into Image Sensors, Position Sensors, Acoustic Sensors and Accelerometer Sensors. Depending on Technology Type, the 3D Sensor Market is segmented into Stereo Vision Technology, Structured Light Technology, Time of Flight Technology and Ultrasound Technology. The different Applications highlighted in the 3D Sensor market are Entertainment, Healthcare, Consumer Electronics, Automotive, Aerospace & Defense, Industrial Robotics, Security & Surveillance and others.
Based on region, 3D Sensor market is segmented into North America (US, Canada, Mexico and Rest of North America), Europe (Germany, UK, France, Russia, Spain, Italy and Rest of Europe), Asia-Pacific (China, Japan, India, South Korea, Singapore, Malaysia and Rest of Asia-Pacific) and Latin America, and Middle East & Africa. North America remained the dominant region in the global 3D Sensor market in 2015. LAMEA would witness highest CAGR during the forecast period (2016-2022).
The report covers the analysis of key stake holders of the 3D Sensor market. Key companies profiled in the report include Microsoft Corporation, Intel Corporation, Infineon Technologies AB, Toshiba Corporation, NXP Semiconductor N.V., Texas Instruments Incorporated, STMicroElectronics N.V. and Samsung Electronics Co. Ltd.


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