Global 3D IC Market Expected To Reach $ 9.14 Million By 2021 With A CAGR Of 17.5%

Date: 2017-07-18

3D IC is an innovative technology that is primarily employed in the electronic industries. 3D IC helps to reduce the size of the component used in any system such as consumer goods and also increase the capability such as speed, memory, efficiency and durability. Hence, 3D IC technology is becoming popular in various industries and seems to be used at growing extent.

The global 3D IC market was estimated at USD$ 4.08 billion in 2016, and is anticipated to reach USD$ 9.14 billion by 2021, expanding at a CAGR of 17.5% between 2017 and 2021. The rise in demand by semiconductor industry for high density and bandwidth, and low power solution, many IC designers are looking up for 3D ICs mounted with through silicon vias (TSVs). 3D ICs accommodate with multiple heterogeneous die such as logic, memory, analog, RF, and micro-electrical mechanical systems thereby improve performance and reduce cost. 3D ICs offers following advantages over traditional system on chips (SoC): low cost, easier to meet high interconnect speeds & bandwidth requirements, ideal for compact mobile devices, reduced resistance-inductance-capacitance helps in reducing power, emerging technologies such as MEMS can potentially be integrated into 3D stacks.

Based on application, the global 3D IC market is segmented into information and communication technology, military, consumer electronics and others. Information and communication technology segment held the largest market share for the 3D IC and accounted for around 26% market share of the total market in 2016. It is followed by consumer electronics and military segments. ICT is also expected to continue the trend in the next few years due to the high adoption rate of 3D IC integration technology. 3D IC market is segmented depending on the substrate used as silicon on insulator (SOI) and bulk silicon. Silicon on insulator (SOI) was the major segment of 3D IC and accounted for largest share of the global demand in 2016. Bulk silicon segment is expected to show moderate growth over the forecast period.

Asia Pacific is the largest regional markets in the global 3D IC market and is expected to retain its dominance owing to significant demand from consumer electronics industries. It is one of the fastest growing regional markets for 3D IC due to growing economies in the region such as China, Japan, South Korea, and India among others. Asia Pacific is expected to have significant growth during the years to come owing to strong demand for smartphones, tablets and other mobile devices in the region.

Asia Pacific was followed by North America and Europe in 2016. North America is expected to have significant growth during the years to come owing to the technological advancement in 3D IC technology. U.S. is the key region in North America and plays a major role in the development of the future 3D IC industry. 3D IC market in North America is predicted to be mainly driven by demand from the U.S. and Canada. 3D IC market is mainly driven by the rising use of consumer electronic devices, rising technological advances, and growing market penetration in developing countries.
 

The Key players such as 3M Company, Tezzaron Semiconductor Corporation, United Microelectronics Corporation, Samsung, Taiwan Semiconductor Manufacturing Company, Ltd., Xilinx, STMicroelectronics and amongst others. 

Read Full Report: 
http://www.gosreports.com/global-3d-ic-market-research-report-2016/ 

Joanna | Executive – International Business and partner Relations
E-mail: info@gosreports.com | Tel: 1-510-400-8520
Web: www.gosreports.com
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